Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.

De Wolf, IngridIngridDe WolfKhaled, AhmadAhmadKhaledKim, Soon-WookSoon-WookKimBeyne, EricEricBeyneKögel, MichaelMichaelKögelBrand, SebastianSebastianBrandDjuric-Rissner, TatianaTatianaDjuric-RissnerIngo, WieslerWieslerIngo2021-10-252021-10-252018-11https://imec-publications.be/handle/20.500.12860/30566Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.Proceedings paper