Lam, Kan WaiKan WaiLamHo, MengMengHoStoukatch, SergueiSergueiStoukatchRatchev, PetarPetarRatchevVath, C.J.C.J.VathSchervan, A.A.SchervanBeyne, EricEricBeyne2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6512Fine pitch copper wire bonding on copper bond pad process optimizationProceedings paper