Fabrication of 100 nm pitch copper interconnects by electron beam lithography

Wu, WenWenWuJonckheere, RikRikJonckheereTokei, ZsoltZsoltTokeiBrongersma, SywertSywertBrongersmaVan Hove, MarleenMarleenVan HoveMaex, KarenKarenMaex2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9940Fabrication of 100 nm pitch copper interconnects by electron beam lithographyJournal article