Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration

Jourdain, AnneAnneJourdainStucchi, MicheleMicheleStucchiVan Der Plas, GeertGeertVan Der PlasBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2023-01-052022-09-172023-01-0520220569-5503WOS:000848765300237https://imec-publications.be/handle/20.500.12860/40438Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous IntegrationProceedings paper10.1109/ECTC51906.2022.00244978-1-6654-7943-1WOS:000848765300237