Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits

Araga, YuukiYuukiAragaNagata, MakotoMakotoNagataVan der Plas, GeertGeertVan der PlasMarchal, PolPolMarchalLibois, MichaelMichaelLiboisLa Manna, AntonioAntonioLa MannaZhang, WenqiWenqiZhangBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-222021-10-222014-062156-3950https://imec-publications.be/handle/20.500.12860/23497Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuitsJournal articlehttp://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=06807746