Oprins, HermanHermanOprinsCherman, VladimirVladimirChermanWebers, TomasTomasWebersKim, Soon-WookSoon-WookKimde Vos, JoeriJoeride VosVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2022-01-252021-11-022022-01-252022-01-2520201936-3958WOS:000701365300030https://imec-publications.be/handle/20.500.12860/374593D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hybrid Cu/dielectric Bonding versus Dielectric via-last BondingProceedings paper978-1-7281-9764-7WOS:000701365300030