Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storage

Cherman, VladimirVladimirChermanDe Messemaeker, JokeJokeDe MessemaekerCroes, KristofKristofCroesDimcic, BiljanaBiljanaDimcicVan der Plas, GeertGeertVan der PlasDe Wolf, IngridIngridDe WolfBeyer, GeraldGeraldBeyerSwinnen, BartBartSwinnenBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20453Impact of Through Silicon Vias on Front-End-of-Line performance after thermal cycling and thermal storageProceedings paper