Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking

Houshmand Sharifi, ShaminShaminHoushmand SharifiDerakhshandeh, JaberJaberDerakhshandehArmini, SilviaSilviaArminiDe Preter, IngeIngeDe PreterBex, PieterPieterBexHou, LinLinHouBartha, Johan WJohan WBarthaNeumann, VolkerVolkerNeumannHerregods, SebastiaanSebastiaanHerregodsNagano, FuyaFuyaNaganoRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerDe Wolf, IngridIngridDe WolfBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28531Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stackingMeeting abstract