Hu, Yu-HsiangYu-HsiangHuLii, M.J.M.J.LiiRebibis, Kenneth JuneKenneth JuneRebibisJourdain, AnneAnneJourdainLa Manna, AntonioAntonioLa MannaBeyne, EricEricBeyneYu, C.H.C.H.Yu2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20828Cu-Cu hybrid bonding as option for 3D IC stackingProceedings paper