Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs

Thaerigen, ThomasThomasThaerigenKanev, StojanStojanKanevKiesewetter, JoergJoergKiesewetterHanaway, PeterPeterHanawayStrid, EricEricStridMarinissen, Erik JanErik JanMarinissenDupas, LucLucDupas2021-10-192021-10-192011-10https://imec-publications.be/handle/20.500.12860/19880Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICsProceedings paperhttp://semiconeuropa.org/ProgramsandEvents/TestandAdvancedPackaging/CTR_030445