Wang, TengTengWangDaily, RobertRobertDailyCapuz, GiovanniGiovanniCapuzGerets, CarineCarineGeretsRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24804Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICsProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6962710