Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects

Fang, YuYuFangCiofi, IvanIvanCiofiRoussel, PhilippePhilippeRousselLesniewska, AlicjaAlicjaLesniewskaDegraeve, RobinRobinDegraeveDe Wolf, IngridIngridDe WolfCroes, KristofKristofCroes2023-11-272023-08-022023-11-2720230018-9383WOS:001030682500001https://imec-publications.be/handle/20.500.12860/42253Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch InterconnectsJournal article10.1109/TED.2023.3287168WOS:001030682500001