Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies

Vandevelde, BartBartVandeveldeBeyne, EricEricBeyneVandepitte, D.D.VandepitteBaelmans, M.M.Baelmans2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6990Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assembliesProceedings paper