Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds

Ceric, H.H.CericZahedmanesh, HoumanHoumanZahedmaneshCroes, KristofKristofCroesLacerda de Orio, R.R.Lacerda de OrioSelberherr, S.S.Selberherr2023-07-052023-04-032023-07-0520230021-8979WOS:000946168200003https://imec-publications.be/handle/20.500.12860/41423Electromigration-induced void evolution and failure of Cu/SiCN hybrid bondsJournal article10.1063/5.0134692WOS:000946168200003DIFFUSIONFORCEMODEL