Enabling interconnect scaling with spacer-defined double patterning (SDDP)

Siew, Yong KongYong KongSiewStucchi, MicheleMicheleStucchiVersluijs, JankoJankoVersluijsRoussel, PhilippePhilippeRousselKunnen, EddyEddyKunnenPantouvaki, MariannaMariannaPantouvakiBeyer, GeraldGeraldBeyerTokei, ZsoltZsoltTokei2021-10-212021-10-2120130167-9317https://imec-publications.be/handle/20.500.12860/23081Enabling interconnect scaling with spacer-defined double patterning (SDDP)Journal article