Soussou, AssawerAssawerSoussouStucchi, MicheleMicheleStucchiJourdain, AnneAnneJourdain2026-10-072026-10-072026978-1-5106-9908-30277-786Xhttps://imec-publications.be/handle/20.500.12860/60541In this work, we evaluated a nano-through-silicon vias (nano-TSV) to buried power rails (BPR) connection that included realistic process effects. Resistance performance was explored to provide design guidelines and RC performance of the backside to frontside connectivity via a nano-TSV connection. Simulation results were also benchmarked against electrical measurements. This type of study can be used to provide Keep out Zone (KoZ) guidelines for TSV integration.engProceedings paper10.1117/12.3090787WOS:0017736898001171996-756X