Impact of wafer thinning on ESD protection devices in 3D integrated systems

Scholz, MirkoMirkoScholzVaisman Chasin, AdrianAdrianVaisman ChasinLinten, DimitriDimitriLintenVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyne2021-10-232021-10-232016-05https://imec-publications.be/handle/20.500.12860/27282Impact of wafer thinning on ESD protection devices in 3D integrated systemsMeeting abstract