Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies

Franco, JacopoJacopoFrancoArimura, HiroakiHiroakiArimurade Marneffe, Jean-FrancoisJean-Francoisde MarneffeVandooren, AnneAnneVandoorenRagnarsson, Lars-AkeLars-AkeRagnarssonWu, Z.Z.WuClaes, D.D.ClaesDentoni Litta, EugenioEugenioDentoni LittaHoriguchi, NaotoNaotoHoriguchiCroes, KristofKristofCroesLinten, DimitriDimitriLintenGrasser, T.T.GrasserKaczer, BenBenKaczer2022-11-172022-09-192022-11-1720212381-3555WOS:000851575300015https://imec-publications.be/handle/20.500.12860/40462Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologiesProceedings paper10.1109/ICICDT51558.2021.9626482978-1-6654-4998-4WOS:000851575300015