Paths towards ultra high-density interconnect 3D systems: contribution of wafer geometry for achieving sub 200nm wafer-to-wafer bonding overlay

Iacovo, SerenaSerenaIacovoDe Vos, JoeriJoeriDe VosPhommahaxay, AlainAlainPhommahaxayMiller, AndyAndyMillerBeyne, EricEricBeyne2021-10-282021-10-282020https://imec-publications.be/handle/20.500.12860/35303Paths towards ultra high-density interconnect 3D systems: contribution of wafer geometry for achieving sub 200nm wafer-to-wafer bonding overlayProceedings paperhttps://imaps.org/device_packaging_2020_program.php