Removal of post-etch 193-nm photoresist in porous low-k dielectric patterning using UV irradiation and ozonated water

Kesters, ElsElsKestersLe, Quoc ToanQuoc ToanLeLux, MarcelMarcelLuxPrager, LutzLutzPragerVereecke, GuyGuyVereecke2021-10-182021-10-1820100167-9317https://imec-publications.be/handle/20.500.12860/17360Removal of post-etch 193-nm photoresist in porous low-k dielectric patterning using UV irradiation and ozonated waterJournal article