Experimental validation of a star-shaped thermal compact model for underfilled flip chip assemblies

Driessens, EvelienEvelienDriessensVandevelde, BartBartVandeveldeBeyne, EricEricBeyneCorlatan, D.D.CorlatanRoose, E.E.Roose2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6289Experimental validation of a star-shaped thermal compact model for underfilled flip chip assembliesProceedings paper