Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers

Redolfi, AugustoAugustoRedolfiVelenis, DimitriosDimitriosVelenisThangaraju, SarasvathiSarasvathiThangarajuNolmans, PhilipPhilipNolmansJaenen, PatrickPatrickJaenenKostermans, MaartenMaartenKostermansBaier, UlrichUlrichBaierVan Besien, ElsElsVan BesienDekkers, HaroldHaroldDekkersWitters, ThomasThomasWittersJourdan, NicolasNicolasJourdanVan Ammel, AnnemieAnnemieVan AmmelVandersmissen, KevinKevinVandersmissenRodet, SimonSimonRodetPhilipsen, HaroldHaroldPhilipsenRadisic, AlexAlexRadisicHeylen, NancyNancyHeylenTravaly, YoussefYoussefTravalySwinnen, BartBartSwinnenBeyne, EricEricBeyne2021-10-192021-10-192011-06https://imec-publications.be/handle/20.500.12860/19677Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafersProceedings paperhttp://www.ectc.net/