Investigation of wafer level packaging schemes for 3D RF interposer multi-chip module

Vereecke, BartBartVereeckeSoussan, PhilippePhilippeSoussanZhu, JianJianZhu2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/29824Investigation of wafer level packaging schemes for 3D RF interposer multi-chip moduleProceedings paperhttp://www.imapsource.org/doi/abs/10.4071/isom-2017-WA41_030?code=imap-site