A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency

Pantano, NicolasNicolasPantanoVan der Plas, GeertGeertVan der PlasBex, PieterPieterBexNolmans, PhilipPhilipNolmansVelenis, DimitriosDimitriosVelenisVerhelst, MarianMarianVerhelstBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33734A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiencyProceedings paperhttps://ieeexplore.ieee.org/document/8811132