A parylene temporary packaging technique for MEMS wafer handling

Wen, LianggongLianggongWenWouters, K.K.WoutersCeyssens, F.F.CeyssensWitvrouw, AnnAnnWitvrouwPuers, BobBobPuers2021-10-202021-10-2020120924-4247https://imec-publications.be/handle/20.500.12860/21846A parylene temporary packaging technique for MEMS wafer handlingJournal articlehttp://dx.doi.org/10.1016/j.sna2012.03.047