Study of Cu diffusion in an Al-1%Si-0.5%Cu bond pad with an Al-1%Si bond wire attached using scanning electron microscopy

Cosemans, P.P.CosemansD'Haen, JanJanD'HaenWitvrouw, AnnAnnWitvrouwProost, JorisJorisProostD'Olieslaeger, MarcMarcD'OlieslaegerDe Ceuninck, WardWardDe CeuninckMaex, KarenKarenMaexDe Schepper, LucLucDe Schepper2021-09-302021-09-301998https://imec-publications.be/handle/20.500.12860/2464Study of Cu diffusion in an Al-1%Si-0.5%Cu bond pad with an Al-1%Si bond wire attached using scanning electron microscopyJournal article