Copper through silicon vias studied by the photo-elastic Scanning Infrared Microscope SIREX

Herms, MartinMartinHermsWagner, M.M.WagnerDe Wolf, IngridIngridDe Wolf2021-10-232021-10-2320160026-2714https://imec-publications.be/handle/20.500.12860/26718Copper through silicon vias studied by the photo-elastic Scanning Infrared Microscope SIREXJournal articlehttp://www.sciencedirect.com/science/article/pii/S0026271416301780