Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration

Van Olmen, JanJanVan OlmenHuyghebaert, CedricCedricHuyghebaertCoenen, JensJensCoenenVan Aelst, JokeJokeVan AelstSleeckx, ErikErikSleeckxVan Ammel, AnnemieAnnemieVan AmmelArmini, SilviaSilviaArminiVaes, JanJanVaesBeyne, EricEricBeyneTravaly, YoussefYoussefTravaly2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/18198Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integrationMeeting abstract