Van der Plas, GeertGeertVan der PlasLimaye, PareshPareshLimayeMercha, AbdelkarimAbdelkarimMerchaOprins, HermanHermanOprinsTorregiani, CristinaCristinaTorregianiThijs, StevenStevenThijsLinten, DimitriDimitriLintenStucchi, MicheleMicheleStucchiGuruprasad, KattiKattiGuruprasadVelenis, DimitriosDimitriosVelenisShinichi, DomaeDomaeShinichiCherman, VladimirVladimirChermanVandevelde, BartBartVandeveldeSimons, VeerleVeerleSimonsDe Wolf, IngridIngridDe WolfLabie, RietRietLabiePerry, DanDanPerryBronckers, StephaneStephaneBronckersMinas, NikolaosNikolaosMinasCupak, MiroslavMiroslavCupakRuythooren, WouterWouterRuythoorenVan Olmen, JanJanVan OlmenPhommahaxay, AlainAlainPhommahaxayde Potter de ten Broeck, MurielMurielde Potter de ten BroeckOpdebeeck, AnnAnnOpdebeeckRakowski, MichalMichalRakowskiDe Wachter, BartBartDe WachterDehan, MorinMorinDehanNelis, MarcMarcNelisAgarwal, RahulRahulAgarwalDehaene, WimWimDehaeneTravaly, YoussefYoussefTravalyMarchal, PolPolMarchalBeyne, EricEricBeyne2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/18167Design issues and cosiderations for low-cost 3D TSV IC technologyProceedings paper