Cherman, VladimirVladimirChermanLofrano, MelinaMelinaLofranoGonzalez, MarioMarioGonzalezCadacio Jr., FranciscoFranciscoCadacio Jr.Rebibis, Kenneth JuneKenneth JuneRebibisBeyne, EricEricBeyneTakano, AkihitoAkihitoTakanoHigashi, MitsutoshiMitsutoshiHigashi2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30408Evaluation of mechanical stress induced during IC packagingProceedings paper