Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet

Chen, YukaiYukaiChenSankatali, VenkateswarluVenkateswarluSankataliMishra, SubratSubratMishraRyckaert, JulienJulienRyckaertMyers, JamesJamesMyersBiswas, DwaipayanDwaipayanBiswas2025-04-162025-01-102025-04-1620242159-3469WOS:001329127500009https://imec-publications.be/handle/20.500.12860/45056Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to NanosheetProceedings paper10.1109/ISVLSI61997.2024.00020979-8-3503-5411-9WOS:001329127500009