Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints

Limaye, PareshPareshLimayeVandevelde, BartBartVandeveldeVerlinden, BertBertVerlindenVandepitte, DirkDirkVandepitte2021-10-162021-10-162005-09https://imec-publications.be/handle/20.500.12860/10786Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder jointsProceedings paper