Flip chip assembly using SBB of high frequency GaAs modules

Stoukatch, SergueiSergueiStoukatchHo, MengMengHoVaesen, KristofKristofVaesenBrebels, StevenStevenBrebelsDe Raedt, WalterWalterDe RaedtBeyne, EricEricBeyne2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6853Flip chip assembly using SBB of high frequency GaAs modulesProceedings paper