Cleaning, rinsing and drying effects in post-Cu CMP clean

Fyen, WimWimFyenVos, RitaRitaVosTeerlinck, IvoIvoTeerlinckVrancken, EviEviVranckenGrillaert, JoostJoostGrillaertMeuris, MarcMarcMeurisMertens, PaulPaulMertensHeyns, MarcMarcHeyns2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4379Cleaning, rinsing and drying effects in post-Cu CMP cleanProceedings paper