Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly

Lofrano, MelinaMelinaLofranoCherman, VladimirVladimirChermanGonzalez, MarioMarioGonzalezBeyne, EricEricBeyne2021-10-252021-10-2520180026-2714https://imec-publications.be/handle/20.500.12860/31222Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assemblyJournal articlehttps://www.sciencedirect.com/science/article/pii/S0026271418303792