Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration

Blanco, VictorVictorBlancoRenaud, VincentVincentRenaudIacovo, SerenaSerenaIacovoJourdain, AnneAnneJourdainHsu, A.A.HsuTseng, Y.Y.TsengTabery, C.C.TaberyDe Poortere, E. P.E. P.De Poortere2025-03-062025-03-062024979-8-3503-8518-22380-632XWOS:001411360600042https://imec-publications.be/handle/20.500.12860/45326Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integrationProceedings paper10.1109/IITC61274.2024.10732582979-8-3503-8517-5WOS:001411360600042