Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route

De Roest, DavidDavidDe RoestTravaly, YoussefYoussefTravalyBeynet, JulienJulienBeynetSprey, HesselHesselSpreyLabat, JulianneJulianneLabatHuffman, CraigCraigHuffmanVerdonck, PatrickPatrickVerdonckKaneko, S.S.KanekoMatsushita, K.K.MatsushitaKobayashi, N.N.KobayashiBeyer, GeraldGeraldBeyer2021-10-172021-10-172009https://imec-publications.be/handle/20.500.12860/15179Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration routeMeeting abstract