Reduced temperature flip-chip technologies on flexible display substrates using adhesives

Vanfleteren, JanJanVanfleterenVandecasteele, BjornBjornVandecasteeleRaevens, S.S.RaevensMäättänen, J.J.MäättänenPerttula, P.P.Perttula2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6998Reduced temperature flip-chip technologies on flexible display substrates using adhesivesProceedings paper