A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structures

Lofrano, MelinaMelinaLofranoGonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeTokei, ZsoltZsoltTokei2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22718A multilevel sub-modeling approach to evaluate 3D IC packaging induced stress on hybrid interconnect structuresMeeting abstract