Analytical and finite element models of the thermal behaviour for lead-free soldering processes in electronic assembly

Van Steenberge, NeleNeleVan SteenbergeVandevelde, BartBartVandeveldeSchildermans, IngeIngeSchildermansWillems, GeertGeertWillems2021-10-162021-10-162005-04https://imec-publications.be/handle/20.500.12860/11442Analytical and finite element models of the thermal behaviour for lead-free soldering processes in electronic assemblyProceedings paper