High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Sterken, TomTomSterkenOp de Beeck, MaaikeMaaikeOp de BeeckVermeiren, FilipFilipVermeirenTorfs, TomTomTorfsWang, LiangLiangWangPriyabadini, SwarnakamalSwarnakamalPriyabadiniDhaenens, KristofKristofDhaenensCuypers, DieterDieterCuypersVanfleteren, JanJanVanfleteren2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21552High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)Proceedings paper