Industry-Relevant Heterojunction IBC Cells and Its Combination with 3D Woven Cell Interconnection Technology, Topped by Record Perovskite Modules for 27+% Tandem Devices

Voroshazi, EszterEszterVoroshaziSivaramakrishnan Radhakrishnan, HariharsudanHariharsudanSivaramakrishnan RadhakrishnanVan Dyck, RikRikVan DyckJaysankar, ManojManojJaysankarKuang, YinghuanYinghuanKuangBorgers, TomTomBorgersGordon, IvanIvanGordonAernouts, TomTomAernoutsGhannam, MoustafaMoustafaGhannamPoortmans, JefJefPoortmansSzlufcik, JozefJozefSzlufcik2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/34406Industry-Relevant Heterojunction IBC Cells and Its Combination with 3D Woven Cell Interconnection Technology, Topped by Record Perovskite Modules for 27+% Tandem DevicesOral presentationhttps://www.mrs.org/fall2019/symposium-sessions/symposium-sessions-detail?code=EN11