Influence of dielectric materials and via geometry on the thermomechanical behavior of silicon through interconnects

Gonzalez, MarioMarioGonzalezLabie, RietRietLabieVandevelde, BartBartVandeveldeBeyne, EricEricBeyne2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/10504Influence of dielectric materials and via geometry on the thermomechanical behavior of silicon through interconnectsProceedings paper