Design, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stack

Marinissen, Erik JanErik JanMarinissenDe Wachter, BartBartDe WachterO'Loughlin, StephenStephenO'LoughlinDeutsch, SergejSergejDeutschPapameletis, ChristosChristosPapameletisBurgherr, TobiasTobiasBurgherr2021-10-222021-10-222014-05https://imec-publications.be/handle/20.500.12860/24202Design, test generation, processing, and pre- and post-bond measurement results of a 3D-DfT demonstrator chip stackProceedings paper