Edge trimming for wafer-to-wafer 3D integration

Inoue, FumihiroFumihiroInoueVisker, JakobJakobViskerJourdain, AnneAnneJourdainMoeller, BertholdBertholdMoellerYokoyama, KaoriKaoriYokoyamaPeng, LanLanPengKosemura, DaisukeDaisukeKosemuraDe Wolf, IngridIngridDe WolfRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyne, EricEricBeyneSleeckx, ErikErikSleeckx2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26766Edge trimming for wafer-to-wafer 3D integrationProceedings paper