Soulie, Jean-PhilippeJean-PhilippeSoulieTokei, ZsoltZsoltTokeiSwerts, JohanJohanSwertsAdelmann, ChristophChristophAdelmann2022-07-082022-05-052022-07-052022-07-0820212380-632XWOS:000784773200031https://imec-publications.be/handle/20.500.12860/39739Aluminide intermetallics for advanced interconnect metallization: thin film studiesProceedings paper10.1109/IITC51362.2021.9537441978-1-7281-7632-1WOS:000784773200031