Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects

Li, YunlongYunlongLiTokei, ZsoltZsoltTokeiMandrekar, T.T.MandrekarMebarki, BencherkiBencherkiMebarkiGroeseneken, GuidoGuidoGroesenekenMaex, KarenKarenMaex2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/10779Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnectsProceedings paper