3D TSV based high frequency components for RF IC and RF MEMS applications

Fernandez-Bolanos, MontserratMontserratFernandez-BolanosVitale, WolfgangWolfgangVitaleMaqueda Lopez, MariazelMariazelMaqueda LopezIonescu, Adrian M.Adrian M.IonescuOcket, IljaIljaOcketDe Raedt, WalterWalterDe RaedtKlumpp, ArminArminKlumppMerkel, R.R.MerkelWeber, J.J.WeberRamm, P.P.RammEnayati, AminAminEnayati2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/266123D TSV based high frequency components for RF IC and RF MEMS applicationsProceedings paperhttp://ieeexplore.ieee.org/document/7970030/