Reduced resistivity of NiAl by backthinning for advanced interconnect metallization

Soulie, Jean-PhilippeJean-PhilippeSoulieTokei, ZsoltZsoltTokeiHeylen, NancyNancyHeylenAdelmann, ChristophChristophAdelmann2023-08-112023-08-072023-08-1120232380-632XWOS:001027381700053https://imec-publications.be/handle/20.500.12860/42288Reduced resistivity of NiAl by backthinning for advanced interconnect metallizationProceedings paper10.1109/IITC/MAM57687.2023.10154878979-8-3503-1097-9WOS:001027381700053