Materials engineering for future interconnects: catalyst-free electroless Cu deposition on self-assembled monolayer alternative barriers

Armini, SilviaSilviaArminiMaestre Caro, ArantxaArantxaMaestre Caro2021-10-182021-10-1820100013-4651https://imec-publications.be/handle/20.500.12860/16663Materials engineering for future interconnects: catalyst-free electroless Cu deposition on self-assembled monolayer alternative barriersJournal article